News & Events

January 15, 2024

Crane Aerospace & Electronics, a segment of Crane Company (NYSE:CR), has launched a new 120-watt family of power conversion products called the Interpoint® xMOR. The Interpoint® xMOR product family features four DC-DC power converters with a shared core architecture, each tailored to address different aerospace and defense market needs.

Crane A&E’s xMOR product family includes its new cMOR (Hi-Rel COTS), hMOR (Class H high-reliability), sMOR (Class K deep space) and rMOR (new space) power converters. The cMOR is a high-reliability, commercial off-the-shelf offering for aerospace and defense applications. The hMOR converter is designed for mission-critical defense applications, is Class H certified and features high efficiency. Crane A&E’s sMOR supports deep space applications, is Class K certified and features high performance and a 19-50V input range. Finally, the rMOR is designed to support the rapidly growing New Space market – featuring up to 92% efficiency in a radiation tolerant design tested to 30krad and 43MeV.

Sept. 27, 2023

Winbond Introduces Innovative CUBE Architecture for Powerful Edge AI Devices

TAICHUNG, Taiwan– 2023-09-27– Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, has unveiled a powerful enabling technology for affordable Edge AI computing in mainstream use cases. The Company’s new customized ultra-bandwidth elements (CUBE) enable memory technology to be optimized for seamless performance running generative AI on hybrid edge/cloud applications.

CUBE enhances the performance of front-end 3D structures such as chip on wafer (CoW) and wafer on wafer (WoW), as well as back-end 2.5D/3D chip on Si-interposer on substrate and fan-out solutions. Designed to meet the growing demands of edge AI computing devices, it is compatible with memory density from 256Mb to 8Gb with a single die, and it can also be 3D stacked to enhance bandwidth while reducing data transfer power consumption.

Winbond is taking a major step forward with CUBE, enabling seamless deployment across various platforms and interfaces. The technology is suited to advanced applications such as wearable and edge server devices, surveillance equipment, ADAS, and co-robots

"The CUBE architecture enables a paradigm shift in AI deployment," says Winbond. "We believe that the integration of cloud AI and powerful edge AI will define the next phase of AI development. With CUBE, we are unlocking new possibilities and paving the way for improved memory performance and cost optimization on powerful Edge AI device."

CUBE's key features include:

Power efficiency:
CUBE delivers exceptional power efficiency, consuming less than 1pJ/bit, ensuring extended operation and optimized energy usage.

Superior performance:
With bandwidth capabilities ranging from 32GB/s to 256GB/s per die, CUBE ensures accelerated performance that exceeds industry standards.

Compact size:
CUBE offers a range of memory capacities from 256Mb to 8Gb per die, based on the 20nm specification now and 16nm in 2025. This allows CUBE to fit into smaller form factors seamlessly. The introduction of through-silicon vias (TSVs) further enhances performance, improving signal and power integrity. Additionally, it reduces the IO area through a smaller pad pitch, as well as heat dissipation, especially when using SoC on the top die and CUBE on the bottom die.

Cost-Effective Solution with High Bandwidth:
Achieving outstanding cost-effectiveness, the CUBE IO boosts an impressive data rate of up to 2Gbps with total 1K IO. When paired with legacy foundry processes like 28nm/22nm SoC, CUBE unleashes ultra-high bandwidth capabilities, reaching an astounding 32GBs-256GB/s (=HBM2 Bandwidth), equivalent to harnessing the power of 4-32pcs*LP-DDR4x 4266Mbps x16 IO bandwidth.

Reduction in SoC Die Size for Improved Cost Efficiency:
By stacking the SoC (top die without TSV) atop the CUBE (bottom die with TSV), it becomes possible to minimize the SoC die size, eliminating any TSVpenalty area. This not only enhances cost advantages, but also contributes to the overall efficiency, including small form factor of Edge AI devices.

"CUBE can unleash the full potential of hybrid edge/cloud AI to elevate system capabilities, response time, and energy efficiency," Winbond added. "Winbond's commitment to innovation and collaboration will enable developers and enterprises to drive advancement across various industries."

Winbond is actively engaging with partner companies to establish the 3DCaaS platform, which will leverage CUBE's capabilities. By integrating CUBE with existing technologies, Winbond aims to offer cutting-edge solutions that empower businesses to thrive in the era of AI-driven transformation.

October 31, 2023

Taoglas Invisible Antenna wins IoT Innovation of the Year Award

Taoglas® is proud to announce that its Taoglas Invisible Antenna™ has been awarded the "IoT Innovation of the Year" by the 2023 Mobile Breakthrough Awards program. The company is honored to be recognized out of thousands of global nominations in various categories and believe this win speaks to its relentless commitment to innovation in the RF, wireless, and IoT industry.

Learn more about the Invisible Antenna on the GNSS, Wi-Fi and Cellular product pages.

See Taoglas and other winners here.

October 26, 2023

u-blox reaches a milestone with the sale of 25 million LTE-M modules. The shipment of 25 million of LTE-M cellular modules reflects the trust customers place in u-blox.

Thalwil, Switzerland – October 26, 2023 a global provider of leading positioning and wireless communication technologies and services, is proud to announce that it just sold its 25 millionth LTE-M cellular module.

The first u-blox LTE-M module, the u-blox SARA-R4, was announced in 2016 and secured all required regulatory and MNO certifications by 2017. Since then, u-blox’s LTE-M cellular modules have played a pivotal role in a broad spectrum of applications, such as aftermarket telematics, metering, utility, industrial automation, monitoring, as well as asset tracking and management.

Being one of the first to launch LTE-M modules and the fastest to ramp up mass-market adoption speaks volumes about the quality and resilience of u-blox’s technology. Our continuous efforts have empowered users to achieve reliable and efficient IoT connectivity innovations.

u-blox’s portfolio of LTE-M modules is designed to address a wide array of both established and emerging applications and use cases. Its leading solutions continue to evolve, becoming smaller, more cost-effective, and increasingly power efficient. In parallel, the market for LTE-M modules in aftermarket telematics, connected healthcare, and asset tracking is experiencing rapid growth.

“LTE-M was the first 4G technology optimized to meet power consumption, performance, and cost requirements for many important industrial IoT applications. We are proud of our industry leadership role as the module provider bringing LTE-M products from an initial concept to a globally adopted solution,” says Stephan Zizala, u-blox CEO. “We have earned the trust of our customers and we will also enable their future innovations with our market-shaping cellular modules.”

Oct. 30, 2023

DISCOVER OUR HIGH-PERFORMANCE POWER FILM CAPACITORS

10/30/23 Are you looking for power film capacitors ? Among its impressive lineup, the FP 20-400-SP film capacitor deserves special attention for its exceptional power-handling capabilities.

UNRAVELING THE FP 20-400-SP

The FP 20-400-SP is a film capacitor that is designed to excel in high-power applications. Here's what sets this capacitor apart:

1. High Power Density: The FP 20-400-SP boasts an extraordinary power density, making it an ideal choice for applications where power is of the essence. Its ability to handle high levels of power without compromising on performance is a testament to Exxelia's commitment to excellence.

Very high current (up to 800A)
Operating frequency up to 1000 KHz
Capacitance : 0.10 µF - 2.5 µF
Voltage : 500 VRMS - 1 000 VRMS
Frequency : 106 kHz - 637 kHz
Max Power : 400 KVAR

2. Robust Construction: Exxelia's engineering prowess is evident in the robust construction of the FP 20-400-SP. It is built to withstand the rigors of demanding environments, ensuring reliability in critical applications.

3. Wide Temperature Range: this film capacitor operates flawlessly across a broad temperature range (Up to 85 °C with a copper casing to improve temperature management), making it suitable for various industries, including aerospace, defense and renewable energy, where extreme conditions are the norm.

Thanks to an innovative process, we're able to keep the capacitor very dense while maintaining very good electrical characteristics (such as current), and this without impairing the heating of the part.

Applications : In demanding power electronic circuits, this capacitor is a trusted component for smooth operation in Induction heating, electric Cars, medical Imaging, EV Wireless Chargers, resonant Circuits and industrial induction welding.

Oct. 26, 2023

Lattice Named Top InfoSec Innovator Awards 2023 Winner with Lattice Sentry Solution Stack

HILLSBORO, Ore. – Oct. 26, 2023 – Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced that it has been named a Top InfoSec Innovator Awards 2023 winner by Cyber Defense Magazine. The latest version of the Lattice Sentry™ solution stack was recognized in the Most Innovative in Embedded Security category.

“Implementing cybersecurity and cyber resiliency in your infrastructure is a must, and leveraging a cutting-edge FPGA-based firmware security solution makes it easier for developers to add layers of protection to applications and systems,” said Eric Sivertson, Vice President of Security Business, Lattice Semiconductor. “We’re honored to receive this prestigious award from Cyber Defense Magazine in recognition of our Sentry solution stack that helps developers integrate strong firmware security and cyber resiliency.”

“Lattice Semiconductor embodies three major features we judges look for with the potential to become winners: understanding tomorrow’s threats, today, providing a cost-effective solution and innovating in unexpected ways that can help mitigate cyber risk and get one step ahead of the next breach,” said Gary S. Miliefsky, Publisher of Cyber Defense Magazine.

The Lattice Sentry solution stack helps developers create cyber resilient system control applications compliant with NIST Platform Firmware Resiliency (PFR) Guidelines (NIST SP-800-193) across the Communications, Computing, Industrial, Automotive, and Consumer markets. Lattice solution stacks are turnkey application-specific solutions that combine reference platforms and designs, demos, IP building blocks, FPGA design tools, and custom design services to accelerate customer application development and time-to-market.